The classic PCBs (printed circuit boards) using organic laminates as the substrate material are evolving toward high accuracy, high density, and high reliability as chip components and SMT (surface mount technology) are widely embraced by the electronics industry. Ceramic Substrate Ceramic PCB, a relatively new class of circuit boards, has drawn a lot of interest from the industry since they are seen as an efficient means of achieving the shrinking of contemporary electronic devices and electronic assembly techniques. The properties, classifications, fabrication process, and uses of ceramic PCBs will all be covered in-depth in this article.
For the production of small electronic products
Currently, human civilization is transitioning to an information society, and there is a pressing need to miniaturize electronic gear including computers, telecommunications equipment, and machinery for autonomous control. Miniaturization was mostly accomplished in the last ten years through the use of semiconductor chip micro-fabrication technologies. The use of micro-fabrication technology is still an early solution for electronics shrinking, even though both LSI (large-scale integration) and VLSI (very large-scale integration) have been making continual progress toward high integration, big scale, and high speed. Since circuit functions cannot be executed in electronic devices or systems unless connection tracing is done, there are several LSI and passive components as well. Therefore, another issue with electronics assembly is how to fit most components on the surface of the smallest circuit board.
A Ceramic PCB's characteristics
The following characteristics distinguish ceramic PCB from conventional PCBs, which have substrates made of epoxy glass fiber, polyimide, polystyrene, and phenolic resin:
Excellent heat conductivity, resistance to chemical degradation, agreeable mechanical intensity, compatibility with component CTE, and ease of high-density tracking implementation
The demands placed on ceramic PCBs in terms of CTE, thermal conductivity, loss, dielectric constant, and tape resistance must be more stringent due to the multiplicity of functions, downsizing, and high speed of electronic devices, as well as the upsizing of IC.
Overall, because of their high heat conductivity, low CTE, and low dielectric constant, Ceramic Substrate Ceramic PCB offer a wide range of applications. They will undoubtedly be important in applications requiring high thermal conductivity, high dependability, and strong air sealing.
