As the commonest components integrated platform, the role of multi-layer PCBs is to connect circuit boards, and components have become highly integrated, leading to the high integrity and high temperature PCB with electronic products becoming light, thin and small in size, and having high performance. Due to this, the heat production has increased and the thermal density of PCBs has increasingly gone up especially due to the mass utilization of high-frequency IC components such as A/D or D/A type.
The reliability of electronic equipment will be greatly influenced if massive thermal loss fails to be sent out. The failure rate of electronic components will increase exponentially with the increase in temperature. The failure rate of some electronic components can increase to twice large once the environment temperature increases by 10°C. Therefore, it is important to pay attention to thermal design during the designing of PCB.
With the cause analysis, the analysis needs to commence. In the existence of power consumption components, the direct cause of the high temperature of PCBs lies. To a different extent, each component has a power consumption that arouses the change in thermal strength. There are two types of temperature increasing phenomena: local temperature rising which is a large area temperature rising and short-term temperature rising. There are three ways of heat transfer: heat conduction, heat convection, and heat radiation. high temperature PCB manufacturer also provides great help.
Through electromagnetic wave motion passing through space, radiation dissipates heat. As the radiation dissipation features a relatively low amount of heat, it is then regarded as an assisted dissipation method.
The major material of metal core PCB covers aluminum, copper, and steel. It can even be used as the ground layer. Through the plated hole the upper layer and lower layer of the metal core PCB can be interconnected and the heat is then transferred to the inner layer and surface of the metal core PCB.
On the board through the bottom and heat conduction hole heating elements can be directly soldered. As a result, in metal core PCB the heat generated by heating elements is directly transferred that then transmits the heat to the tangent chassis by the heat conduction hole and sends it out. high temperature PCB with such a structure has a wide series of applications but they can also result in some problems.
