IC substrates are the last stage of PCB production and have many parallels with semiconductor processing. Based on Flip Chip technology, manufacturing packaging of high-performance Integrated Circuits is widely employed in mobile devices like smart phones, tablet computers, personal computers, graphics workstations, servers, and IT equipment. IC Substrate PCB work as the connection between the IC chip(s) and PCB through a patterned network of conductors and has plated through holes.
Flip Chip Package Substrate solutions
The product is a package substrate, which is used for the core semiconductors of cellphones and PCs. It links semiconductors and the main board electric signals and at the same time protects costly semiconductors from pressures. However, because this substrate is a high-density circuit substrate with more microcircuits, assembly defects and the cost of connecting expensive semiconductors directly to the substrate can be reduced.
Classification of FCP Package Substrate
Integrated circuit packaging board (also known as IC Substrate) is one of the most crucial parts of the IC Substrate PCB. It is a direct carrier for semiconductor grains DIE and many different passive devices which are referred to as Passives. It also contributes greatly towards the enhanced packaging at the higher level. The packaging board plays the role of telecommunications interconnection, performance enhancement, fixed support, heat dissipation and isolation protection for grains of semiconductor and various passive devices. It plays an important role in achieving the goals of thin package, miniaturization, high density and high performance of integrated circuits.
SiP Package Substrate
• SiP is short for ‘System in Package’, which defines the semiconductor module that combines one or more semiconductor chips and passive components to offer system-level electrical characteristics.
• SiP Package Substrate Features
• The Via Post or Copper pillar is a sequential build-up substrate plating technique where one layer can begin and be linked to another at any point.
• Replacing laser via by via post or copper pillar to achieve the goal of interconnection of any layer and any shape.
• The coplanar characteristic of copper pillar interconnection can enhance the performance of RF package and guarantee the signal quality.
Embedded Package Substrate/Module
Thus, this chip embedded IC Substrate PCB frees the surface area on top to add further chips and passives devices on the top side to achieve a superior level of integration in the 3D structure.
